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• W2040315932 abstract "3D integration technology is the key for future LSIs with high-performance, low-power and multi-functionality. Especially, to mitigate various concerns caused by device scaling down to 10 nm or less, it is indispensable to introduce a new concept of heterogeneous 3D integration in which various kinds of materials, devices and technologies are integrated on a Si substrate. Future prospects of such a heterogeneous 3D integration technology has been discussed representing typical examples of heterogeneous 3D LSIs after the present situation of 3D integration technology is described." @default.
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• W2040315932 creator A5059487693 @default.
• W2040315932 date "2015-01-01" @default.
• W2040315932 modified "2023-09-29" @default.
• W2040315932 title "Recent progress in 3D integration technology" @default.
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• W2040315932 doi "https://doi.org/10.1587/elex.12.20152001" @default.
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