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• W2040696145 abstract "Before the wire bonding or flip-chip package is executed, the die-attachment process must be implemented first. In this study, we observe that the quality, sticking process, epoxy-resin diffusion and thickness of silver paste agglutinating the die and the lead-frame critically determine the final package performance." @default.
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• W2040696145 date "2010-08-01" @default.
• W2040696145 modified "2023-10-18" @default.
• W2040696145 title "Performance of silver-glue attachment technology in assembly" @default.
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• W2040696145 doi "https://doi.org/10.1109/icept.2010.5583797" @default.
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