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- W2040698210 abstract "Cu films deposited on Si substrates were bombarded with 2.0, 3.0 and 4.0 MeV Cl ions. It is found that there are two types of enhanced adhesion effects in the Cu-Si system. One occurs in the very low dose range, the other at higher doses. For the case of low dose adhesion, the surfaces of the bombarded Si substrate were observed after different doses by scanning electron microscopy (SEM). The micrographs show that no microcracks exist on the surfaces. This result seems to disagree with previous explanations of low dose enhanced adhesion caused by surface crazing of the substrate. An acid corrosion test indicates that the corrosion resisting capabilities in the low and high dose adhesion areas are clearly distinguishable." @default.
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- W2040698210 date "1990-01-01" @default.
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- W2040698210 title "Low and high dose enhanced adhesion effects induced by fast heavy ion beams for Cu films on Si" @default.
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- W2040698210 doi "https://doi.org/10.1016/0168-583x(90)90649-f" @default.
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