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• W2040889158 abstract "Thermal flow sensors have been designed, fabricated, and characterized. All bulk material in these devices is silicon so that they are integratable in silicon-based microsystems. To mitigate heat losses and to allow for use of corrosive gases, the heating and sensing thin film titanium/platinum elements, injecting and extracting heat, respectively, from the flow, are placed outside the channel on top of a membrane consisting of alternating layers of stress-balancing silicon dioxide and silicon nitride. For the fabrication, an unconventional bond surface protection method using sputter-deposited aluminum instead of thermal silicon dioxide is used in the process steps prior to silicon fusion bonding. A method for performing lift-off on top of the transparent membrane was also developed. The sensors, measuring 9.5 × 9.5 mm2, are characterized in calorimetric and time-of-flight modes with nitrogen flow rates between 0 sccm and 300 sccm. The maximum calorimetric sensor flow signal and sensitivity are 0.95 mV and 29 µV sccm−1, respectively, with power consumption less than 40 mW. The time-of-flight mode is found to have a wider detectable flow range compared with calorimetric mode, and the time of flight measured indicates a response time of the sensor in the millisecond range. The design and operation of a sensor with high sensitivity and large flow range are discussed. A key element of this discussion is the configuration of the array of heaters and gauges along the channel to obtain different sensitivities and extend the operational range. This means that the sensor can be tailored to different flow ranges." @default.
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• W2040889158 date "2012-05-17" @default.
• W2040889158 modified "2023-10-14" @default.
• W2040889158 title "A highly integratable silicon thermal gas flow sensor" @default.
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• W2040889158 doi "https://doi.org/10.1088/0960-1317/22/6/065015" @default.
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