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• W2041128708 abstract "본 논문에서는 간단한 플라스틱전자패키지의 폴리머 흡습특성 평가 방법을 제시하였다. 흡습팽창에 의한 변형을 측정하고 유한요소법으로 해석하였다. 흡습특성 평가를 위해 시편제작을 제작하고, 흡습시간에 따라 폴리머에 내재된 수분질량을 측정하여, 수치해석 결과와 비교분석하였다. 흡습확산 방정식은 열전달 방정식과 유사한 형태를 가지고 있기 때문에 열전달 해석 절차에 따라 상용 유한요소코드를 적용하여 흡습압력비를 구하고, 자체코드로 흡습질량을 계산하였다. 비전도성 폴리머는 동일 제품이라도 생산시기에 따라 흡습특성에 변화가 있었다. 여러 가지 흡습특성에 대해 흡습질량을 수치해석으로부터 계산하고 측정치에 가장 근접한 흡습질량 변화의 그래프를 선택하여 최적의 확산계수와 용해도를 구하였다. 제시된 방법은 빠른 대응을 요구하는 생산현장에서 반도체 패키지 폴리머의 흡습특성을 신속하게 평가하는 데 적용될 수 있을 것이다. 또한 흡습팽창을 모아레 간섭계로 측정하고 수치해석으로 비교하였다. 결과적으로 흡습질량의 측정값과 수치해석 결과를 비교하여 용해도와 확산계수는 0.0320 [g/mm/N]과 0.243 [ $mm^2/{mu}s$ ]으로 결정하였고, ANSYS 구조해석에 의한 변형은 모아레 간섭에 의한 측정결과와 매우 유사하였다. 【A simple method to evaluate the hygroscopic characteristics of polymer of microelectronic plastic package is suggested. To evaluate the characteristics, specimens were prepared, and the internally absorbed moisture masses were measured as a function of the absorbing time and calculated numerically. The hygroscopic pressure ratio was calculated by heat transfer analysis supported by commercial FEM code because the hygroscopic diffusion equation has the same form as the heat transfer equation. The moisture masses were then summed by the self developed code. The nonconductive polymers had quite different characteristics for the different lots, even though they were the same products. The absorbed moisture mass variations were calculated for several different characteristics, and the optimal curve of the mass variation close to experimental data was selected, whose solubility and diffusivity were affected by the hygroscopic characteristics of the material. The method can be useful in the industrial fields to quickly characterize the polymer material of the semiconductor package because the fast correspondence is normally required in industry. The weight changes in the aluminum-nonconductive-polymer joint due to moisture absorption were measured. The deformed system was also measured using the Moire Interferometry system and compared with the results of finite element analysis.】" @default.
• W2041128708 created "2016-06-24" @default.
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• W2041128708 date "2014-06-30" @default.
• W2041128708 modified "2023-09-24" @default.
• W2041128708 title "Moire Interferometry Measurement and Numerical Analysis for Hygroscopic Swelling of Al-Polymer Joint" @default.
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• W2041128708 doi "https://doi.org/10.5762/kais.2014.15.6.3442" @default.
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