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- W2041651538 abstract "A model to describe removal rates during silicon dioxide polishing has been developed and validated. The model includes submodels for the bulk pad behavior, the behavior of pad asperities, and the pad-wafer relative velocity." @default.
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- W2041651538 date "2004-01-01" @default.
- W2041651538 modified "2023-09-27" @default.
- W2041651538 title "A wafer-scale removal rate model for chemical mechanical planarization" @default.
- W2041651538 doi "https://doi.org/10.1364/oft.2004.omc3" @default.
- W2041651538 hasPublicationYear "2004" @default.
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