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• W2041945484 abstract "With the development of 3D integration technology, microsystems with vertical interconnects are attracting attention from researchers and industry applications. Basic elements of integrated passive devices (IPDs), including inductors, capacitors, and resistors, could dramatically save the footprint of the system, optimize the form factor, and improve the performance of radio frequency (RF) systems. In this paper, IPDs using thin film built-up technology are introduced, and the design and characterization of coplanar waveguides (CPWs), inductors, and capacitors are presented." @default.
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• W2041945484 date "2013-04-01" @default.
• W2041945484 modified "2023-09-30" @default.
• W2041945484 title "Electrical characterization of integrated passive devices using thin film technology for 3D integration" @default.
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• W2041945484 doi "https://doi.org/10.1631/jzus.c12mnt01" @default.
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