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- W2042865587 abstract "A 1 GHz AT-cut quartz thickness shear mode resonator is modeled for the first time with thermally induced bonding stresses and their effect on the device frequency-temperature (f-T) characteristic. Without the details of the bonding configuration, modeling indicates the f-T characteristic slightly rotates as a function of the change in stiffness of a simplified absorbing mount. However, if details of the bonding configuration are included, our modeling predicts the potential for a significant distortion in the f-T curve. High or varying stress over temperature in the device active region is found to lead to an undesirable increase in the f-T slope. The origin of the active region stress can be varied, but in practice it frequently originates from a temperature dependent bonding stress, or from fabrication steps such as metal depositions. In this paper we highlight the magnitude of the thermal stress effect on the f-T curve, and offer design methods that mitigate the thermally induced bonding stress by de-coupling the active resonator area from high stress regions of the quartz device." @default.
- W2042865587 created "2016-06-24" @default.
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- W2042865587 date "2013-07-01" @default.
- W2042865587 modified "2023-09-22" @default.
- W2042865587 title "Optimizing UHF quartz MEMs resonators for high thermal stability" @default.
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- W2042865587 doi "https://doi.org/10.1109/eftf-ifc.2013.6702212" @default.
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