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- W2044006039 abstract "A Cu nanoparticles/polyimide (PI) or Cu <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sub> O nanoparticles/PI hybrid materials were fabricated by curing at 350°C for 2 hours in H <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sub> or N <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sub> atmosphere respectively, which resulted from the decomposition of the complex formed between a Cu film and the PI precursor, polyamic acid (PAA). Two kinds of PI films, thermosetting PI and thermoplastic PI were used. The Al was deposited on the top PI as the top electrode and In as the bottom electrode was soldered on the back side of the samples. The memory effect of Al/PI/Cu (or Cu <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sub> O) nanoparticles/PI/ju-type Si (100) structure will be also discussed with the results of the capacitance-voltage (C-V) measured at room temperature." @default.
- W2044006039 created "2016-06-24" @default.
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- W2044006039 date "2010-01-01" @default.
- W2044006039 modified "2023-09-27" @default.
- W2044006039 title "Formation of Cu or CU<inf>2</inf>O nanoparticles embedded in a polyimide film for nanofloating gate memory" @default.
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- W2044006039 doi "https://doi.org/10.1109/inec.2010.5424661" @default.
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