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• W2044202389 abstract "Synchrotron radiation real-time in situ imaging technology was conducted to investigate the interfacial reaction in line-type Cu/Sn-9Zn/Cu interconnect under a current density of 1.2×10 <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>4</sup> A/cm <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sup> at 250°C. A reverse polarity effect, i.e., the intermetallic compound (IMC) layer at the cathode grew continuously while that at the anode was restrained, was observed in Cu/Sn-9Zn/Cu interconnects. With increasing liquid-solid electromigration (L-S EM) time, the initial interfacial Cu <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>5</sub> Zn <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>8</sub> gradually transformed into Cu <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>6</sub> (Sn, Zn) <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>5</sub> at the anode, while into a mixture of Cu <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>5</sub> Zn <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>8</sub> and Cu <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>6</sub> (Sn, Zn) <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>5</sub> at the cathode. This provided a clear evidence that Zn atoms were migrating from the anode toward the cathode undergoing L-S EM, which is different from the normal diffusion behavior of atoms. Since there is no back-stress undergoing L-S EM, it is deduced that the effective charge number (Z*) of Zn atoms became positive, resulting in the directional migration of Zn atoms from the anode toward the cathode under electron current stressing." @default.
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• W2044202389 date "2013-08-01" @default.
• W2044202389 modified "2023-10-16" @default.
• W2044202389 title "Study on liquid-solid electromigration in Cu/Sn-9Zn/Cu interconnect using synchrotron radiation real-time in situ imaging technology" @default.
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• W2044202389 doi "https://doi.org/10.1109/icept.2013.6756438" @default.
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