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• W2044476428 abstract "Aluminium nitride films were deposited by reactive sputtering on steel substrates (H11) with the aim of realising anti-corrosion coatings. The porosity of the films combined with their inadequate thickness cause the good initial corrosion resistance of the samples to decrease drastically during immersion time in a 0.5 M NaCl solution. In order to create a corrosion barrier between AlN and steel, three types of under-layers were investigated: nickel under-layers (with a thickness of about 10 μm) deposited by both electrochemical and electroless methods, and titanium under-layers (with a thickness of about 1 μm) obtained by sputtering. The structure and morphology of the samples were studied from X-ray diffraction (XRD), atomic force microscopy (AFM) and scanning electron microscopy (SEM) observations. Electrochemical impedance spectroscopy (EIS) tests versus immersion time were carried out in a 0.5 M NaCl solution in order to compare their corrosion resistance. It appears that AlN/electroless nickel shows the best corrosion resistance, whereas the AlN/electrochemical nickel and AlN/titanium samples are almost in the same range." @default.
• W2044476428 created "2016-06-24" @default.
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• W2044476428 date "2001-08-01" @default.
• W2044476428 modified "2023-10-14" @default.
• W2044476428 title "Improvement of the electrochemical behaviour of AlN films produced by reactive sputtering using various under-layers" @default.
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• W2044476428 doi "https://doi.org/10.1016/s0013-4686(01)00669-7" @default.
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