Matches in SemOpenAlex for { <https://semopenalex.org/work/W2045182014> ?p ?o ?g. }
Showing items 1 to 99 of
99
with 100 items per page.
- W2045182014 abstract "The industry keeps driving further miniaturization of electronic packaging for portable and handheld products, and wafer level chip scaling package (WLCSP) has high potential to fulfill these requirements. Larger chip can accommodate more functions. However, fatigue failure of WLCSP solder joint caused by material coefficient of thermal expansion (CTE) mismatch is getting worse due to chip size increase. Researches of WLCSP design optimization for solder joint reliability enhancement are available in the literature, such as the effect of die thickness and printed circuit board (PCB) thickness, but not detail to the study on solder joint creep behavior along thermal cycling ramp and dwell period. In this paper, the solder joint creep behavior on WLCSP with different die thickness under thermal cycling loading will be studied. This study will leverage an ultra large die, 14mm × 14mm full array WLCSP with 0.4mm ball pitch, 0.25mm ball size and SAC ball material, as test vehicle and apply JEDEC compliant thermal cycling profile with 10 minutes of dwell time and 10 minutes of ramp time for simulation result validation. Finite element models (FEM) with Garofalo-Arrhenius creep constitutive equation is conducted for solder joint creep behavior analysis. The result of the thermal cycling experimental test show good agreement with the FEM model. The FEM result using thin die approach will explain the mechanism of solder joint creep accumulation during thermal cycling loading, and the finding of die to PCB thickness ratio can be design reference for system designer." @default.
- W2045182014 created "2016-06-24" @default.
- W2045182014 creator A5029504118 @default.
- W2045182014 creator A5069751039 @default.
- W2045182014 date "2014-04-01" @default.
- W2045182014 modified "2023-10-17" @default.
- W2045182014 title "Investigation of solder creep behavior on wafer level CSP under thermal cycling loading" @default.
- W2045182014 cites W1908886214 @default.
- W2045182014 cites W1978658599 @default.
- W2045182014 cites W2066199252 @default.
- W2045182014 cites W2108467995 @default.
- W2045182014 cites W2113285486 @default.
- W2045182014 cites W2124553079 @default.
- W2045182014 cites W2125405013 @default.
- W2045182014 cites W2129529912 @default.
- W2045182014 cites W2133619935 @default.
- W2045182014 cites W2149104174 @default.
- W2045182014 cites W2170052953 @default.
- W2045182014 cites W2540848675 @default.
- W2045182014 cites W2563427918 @default.
- W2045182014 doi "https://doi.org/10.1109/icep.2014.6826729" @default.
- W2045182014 hasPublicationYear "2014" @default.
- W2045182014 type Work @default.
- W2045182014 sameAs 2045182014 @default.
- W2045182014 citedByCount "2" @default.
- W2045182014 countsByYear W20451820142016 @default.
- W2045182014 countsByYear W20451820142017 @default.
- W2045182014 crossrefType "proceedings-article" @default.
- W2045182014 hasAuthorship W2045182014A5029504118 @default.
- W2045182014 hasAuthorship W2045182014A5069751039 @default.
- W2045182014 hasConcept C119599485 @default.
- W2045182014 hasConcept C120793396 @default.
- W2045182014 hasConcept C121332964 @default.
- W2045182014 hasConcept C126233035 @default.
- W2045182014 hasConcept C127413603 @default.
- W2045182014 hasConcept C135628077 @default.
- W2045182014 hasConcept C149912024 @default.
- W2045182014 hasConcept C151637689 @default.
- W2045182014 hasConcept C153294291 @default.
- W2045182014 hasConcept C159985019 @default.
- W2045182014 hasConcept C160671074 @default.
- W2045182014 hasConcept C171250308 @default.
- W2045182014 hasConcept C177564732 @default.
- W2045182014 hasConcept C192562407 @default.
- W2045182014 hasConcept C204530211 @default.
- W2045182014 hasConcept C2779227376 @default.
- W2045182014 hasConcept C2780288131 @default.
- W2045182014 hasConcept C49040817 @default.
- W2045182014 hasConcept C50296614 @default.
- W2045182014 hasConcept C57528182 @default.
- W2045182014 hasConcept C66938386 @default.
- W2045182014 hasConcept C68928338 @default.
- W2045182014 hasConcept C70410870 @default.
- W2045182014 hasConcept C71924100 @default.
- W2045182014 hasConcept C78519656 @default.
- W2045182014 hasConcept C79072407 @default.
- W2045182014 hasConceptScore W2045182014C119599485 @default.
- W2045182014 hasConceptScore W2045182014C120793396 @default.
- W2045182014 hasConceptScore W2045182014C121332964 @default.
- W2045182014 hasConceptScore W2045182014C126233035 @default.
- W2045182014 hasConceptScore W2045182014C127413603 @default.
- W2045182014 hasConceptScore W2045182014C135628077 @default.
- W2045182014 hasConceptScore W2045182014C149912024 @default.
- W2045182014 hasConceptScore W2045182014C151637689 @default.
- W2045182014 hasConceptScore W2045182014C153294291 @default.
- W2045182014 hasConceptScore W2045182014C159985019 @default.
- W2045182014 hasConceptScore W2045182014C160671074 @default.
- W2045182014 hasConceptScore W2045182014C171250308 @default.
- W2045182014 hasConceptScore W2045182014C177564732 @default.
- W2045182014 hasConceptScore W2045182014C192562407 @default.
- W2045182014 hasConceptScore W2045182014C204530211 @default.
- W2045182014 hasConceptScore W2045182014C2779227376 @default.
- W2045182014 hasConceptScore W2045182014C2780288131 @default.
- W2045182014 hasConceptScore W2045182014C49040817 @default.
- W2045182014 hasConceptScore W2045182014C50296614 @default.
- W2045182014 hasConceptScore W2045182014C57528182 @default.
- W2045182014 hasConceptScore W2045182014C66938386 @default.
- W2045182014 hasConceptScore W2045182014C68928338 @default.
- W2045182014 hasConceptScore W2045182014C70410870 @default.
- W2045182014 hasConceptScore W2045182014C71924100 @default.
- W2045182014 hasConceptScore W2045182014C78519656 @default.
- W2045182014 hasConceptScore W2045182014C79072407 @default.
- W2045182014 hasLocation W20451820141 @default.
- W2045182014 hasOpenAccess W2045182014 @default.
- W2045182014 hasPrimaryLocation W20451820141 @default.
- W2045182014 hasRelatedWork W2045182014 @default.
- W2045182014 hasRelatedWork W2104142804 @default.
- W2045182014 hasRelatedWork W2118324141 @default.
- W2045182014 hasRelatedWork W2133594326 @default.
- W2045182014 hasRelatedWork W2155956097 @default.
- W2045182014 hasRelatedWork W2158483827 @default.
- W2045182014 hasRelatedWork W2558095264 @default.
- W2045182014 hasRelatedWork W2563427918 @default.
- W2045182014 hasRelatedWork W2970667375 @default.
- W2045182014 hasRelatedWork W3015357499 @default.
- W2045182014 isParatext "false" @default.
- W2045182014 isRetracted "false" @default.
- W2045182014 magId "2045182014" @default.
- W2045182014 workType "article" @default.