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• W2045183076 abstract "This paper presents a new silicon technology that is used for innovative components such as a MicroElectroMechanical Systems for microwave and millimeter-wave applications. This technology is based on two different bulk and surface silicon micro- machining processes. The former one, the bulk micro-machining, is well fitted to the realization of low loss microwave circuits suspended on a thin membrane, whereas the surface one allows the realization of actuable devices. This confers to the structure an interesting MEM behavior particularly important in millimeter- wave applications. As a demonstration of the advantage of combining surface and bulk micromachining a low loss (< 0.1 dB at 100 GHz), high isolation (approximately equals 30 dB at 10 GHz) capacitive switch has been designed, processed and measured. A distributed switch with enhanced performance has also been investigated." @default.
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• W2045183076 date "2001-04-30" @default.
• W2045183076 modified "2023-10-18" @default.
• W2045183076 title "<title>Silicon MEM technology for millimeter-wave applications</title>" @default.
• W2045183076 doi "https://doi.org/10.1117/12.425307" @default.
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