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• W2045284230 endingPage "687" @default.
• W2045284230 startingPage "683" @default.
• W2045284230 abstract "Chemical modification of the buried interfaces between silicon wafers and either polystyrene or poly(methyl methacrylate) (PMMA) with the reagent (tridecafluoro-1,1,2,2-tetrahydrooctyl)dimethylchlorosilane (FDCS) was studied using liquid and supercritical carbon dioxide as the solvent and infusing agent. Above the critical point of CO2, FDCS reacts with surface silanols at the SiO2/polystyrene interface to form a monolayer, which was analyzed after removal of the polystyrene film. This is not the case below the critical point, and likely the lower diffusivity and solvent properties of the CO2-swollen film are the causes. The reaction was much less successful at the SiO2/PMMA interface. We suspect that because of strong hydrogen bonding between PMMA and the silicon substrate, modification of the SiO2/PMMA interface is achieved to only a limited extent." @default.
• W2045284230 created "2016-06-24" @default.
• W2045284230 creator A5008493329 @default.
• W2045284230 creator A5074584646 @default.
• W2045284230 date "2002-01-29" @default.
• W2045284230 modified "2023-10-14" @default.
• W2045284230 title "Buried Interface Modification Using Supercritical Carbon Dioxide" @default.
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• W2045284230 doi "https://doi.org/10.1021/la010768c" @default.
• W2045284230 hasPublicationYear "2002" @default.
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