FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W2045380027> ?p ?o ?g. }

• W2045380027 endingPage "036502" @default.
• W2045380027 startingPage "036502" @default.
• W2045380027 abstract "Extreme ultraviolet lithography (EUVL) has been developed and studied for a sub-22 nm semiconductor device. It is difficult to obtain a smooth sub-22 nm pattern because line edge roughness (LER) and linewidth roughness (LWR) cannot be controlled well. According to the 2008 ITRS roadmap, LER has to be below 1.3 nm to achieve a 22 nm node for EUVL. In our previous work, the resist reflow process (RRP), in which the resist is baked above the glass transition temperature ( T g ), was very helpful for reducing LER and LWR for EUVL. LER and LWR could be decreased from ∼6 to ∼1 nm. As RRP time progresses, however, the critical dimension could become wider because the developed resist can flow more easily when the temperature is above T g . Therefore, another method is suggested to solve this problem. The developed resist, which is intentionally designed with a 1:3 line and space (L/S) (11:33 nm) pattern, is baked above T g . As a result, LER and LWR can be smoothed by RRP and we could achieve a 22 nm 1:1 L/S pattern with a small LER." @default.
• W2045380027 created "2016-06-24" @default.
• W2045380027 creator A5016692431 @default.
• W2045380027 creator A5041572321 @default.
• W2045380027 creator A5046824507 @default.
• W2045380027 creator A5071200569 @default.
• W2045380027 date "2010-03-01" @default.
• W2045380027 modified "2023-10-18" @default.
• W2045380027 title "Line Edge Roughness Reduction Using Resist Reflow Process for 22 nm Node Extreme Ultraviolet Lithography" @default.
• W2045380027 cites W1972561470 @default.
• W2045380027 cites W1982732466 @default.
• W2045380027 cites W1987283281 @default.
• W2045380027 cites W1992347385 @default.
• W2045380027 cites W1993710000 @default.
• W2045380027 cites W2007157043 @default.
• W2045380027 cites W2012397669 @default.
• W2045380027 cites W2021217443 @default.
• W2045380027 cites W2023743838 @default.
• W2045380027 cites W2027179488 @default.
• W2045380027 cites W2027690824 @default.
• W2045380027 cites W2044439362 @default.
• W2045380027 cites W2049018842 @default.
• W2045380027 cites W2049845961 @default.
• W2045380027 cites W2052499341 @default.
• W2045380027 cites W2062629415 @default.
• W2045380027 cites W2066447167 @default.
• W2045380027 cites W2073474270 @default.
• W2045380027 cites W2091736704 @default.
• W2045380027 cites W2096384080 @default.
• W2045380027 cites W2157655137 @default.
• W2045380027 cites W4253549840 @default.
• W2045380027 doi "https://doi.org/10.1143/jjap.49.036502" @default.
• W2045380027 hasPublicationYear "2010" @default.
• W2045380027 type Work @default.
• W2045380027 sameAs 2045380027 @default.
• W2045380027 citedByCount "5" @default.
• W2045380027 countsByYear W20453800272013 @default.
• W2045380027 countsByYear W20453800272014 @default.
• W2045380027 crossrefType "journal-article" @default.
• W2045380027 hasAuthorship W2045380027A5016692431 @default.
• W2045380027 hasAuthorship W2045380027A5041572321 @default.
• W2045380027 hasAuthorship W2045380027A5046824507 @default.
• W2045380027 hasAuthorship W2045380027A5071200569 @default.
• W2045380027 hasConcept C105487726 @default.
• W2045380027 hasConcept C107365816 @default.
• W2045380027 hasConcept C120665830 @default.
• W2045380027 hasConcept C121332964 @default.
• W2045380027 hasConcept C142181693 @default.
• W2045380027 hasConcept C146024833 @default.
• W2045380027 hasConcept C159985019 @default.
• W2045380027 hasConcept C162307627 @default.
• W2045380027 hasConcept C162996421 @default.
• W2045380027 hasConcept C163581340 @default.
• W2045380027 hasConcept C171250308 @default.
• W2045380027 hasConcept C177409738 @default.
• W2045380027 hasConcept C192562407 @default.
• W2045380027 hasConcept C200274948 @default.
• W2045380027 hasConcept C204223013 @default.
• W2045380027 hasConcept C207789793 @default.
• W2045380027 hasConcept C2779227376 @default.
• W2045380027 hasConcept C41008148 @default.
• W2045380027 hasConcept C49040817 @default.
• W2045380027 hasConcept C520434653 @default.
• W2045380027 hasConcept C53524968 @default.
• W2045380027 hasConcept C71039073 @default.
• W2045380027 hasConcept C76155785 @default.
• W2045380027 hasConceptScore W2045380027C105487726 @default.
• W2045380027 hasConceptScore W2045380027C107365816 @default.
• W2045380027 hasConceptScore W2045380027C120665830 @default.
• W2045380027 hasConceptScore W2045380027C121332964 @default.
• W2045380027 hasConceptScore W2045380027C142181693 @default.
• W2045380027 hasConceptScore W2045380027C146024833 @default.
• W2045380027 hasConceptScore W2045380027C159985019 @default.
• W2045380027 hasConceptScore W2045380027C162307627 @default.
• W2045380027 hasConceptScore W2045380027C162996421 @default.
• W2045380027 hasConceptScore W2045380027C163581340 @default.
• W2045380027 hasConceptScore W2045380027C171250308 @default.
• W2045380027 hasConceptScore W2045380027C177409738 @default.
• W2045380027 hasConceptScore W2045380027C192562407 @default.
• W2045380027 hasConceptScore W2045380027C200274948 @default.
• W2045380027 hasConceptScore W2045380027C204223013 @default.
• W2045380027 hasConceptScore W2045380027C207789793 @default.
• W2045380027 hasConceptScore W2045380027C2779227376 @default.
• W2045380027 hasConceptScore W2045380027C41008148 @default.
• W2045380027 hasConceptScore W2045380027C49040817 @default.
• W2045380027 hasConceptScore W2045380027C520434653 @default.
• W2045380027 hasConceptScore W2045380027C53524968 @default.
• W2045380027 hasConceptScore W2045380027C71039073 @default.
• W2045380027 hasConceptScore W2045380027C76155785 @default.
• W2045380027 hasIssue "3R" @default.
• W2045380027 hasLocation W20453800271 @default.
• W2045380027 hasOpenAccess W2045380027 @default.
• W2045380027 hasPrimaryLocation W20453800271 @default.
• W2045380027 hasRelatedWork W1980189337 @default.
• W2045380027 hasRelatedWork W1998341457 @default.
• W2045380027 hasRelatedWork W2045380027 @default.
• W2045380027 hasRelatedWork W2064596508 @default.
• W2045380027 hasRelatedWork W2080447637 @default.

• next