FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W2045497019> ?p ?o ?g. }

• W2045497019 abstract "This paper will focus on recent results of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking. We report on bonding quality, wafer-to-wafer alignment accuracy and electrical connectivity. Specific pre-bonding surface conditioning is necessary to insure high bonding quality of patterned Cu wafers. A particular concern is related to the planarization (e.g. CMP) of Cu-SiO <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</inf> hybrid surfaces: copper dishing and erosion need to be minimized in order to obtain high bonding quality. The bonding quality is assessed by the evaluation of bonding strength, interfacial defects, wafer-to-wafer misalignment and electrical contact resistance at the Cu-Cu interface. The bonding strength evolution with post-bond annealing is reported and discussed for the case of patterned surfaces. Scanning Acoustic Microscopy (SAM) imaging of bonding interface is performed to monitor bonded defects. Process conditions have been optimized to minimize the post bond annealing (thermal budget) at temperatures below 400°C." @default.
• W2045497019 created "2016-06-24" @default.
• W2045497019 creator A5004087886 @default.
• W2045497019 creator A5006386276 @default.
• W2045497019 creator A5007776830 @default.
• W2045497019 creator A5007784067 @default.
• W2045497019 creator A5008648057 @default.
• W2045497019 creator A5010370732 @default.
• W2045497019 creator A5023518662 @default.
• W2045497019 creator A5026052355 @default.
• W2045497019 creator A5033364386 @default.
• W2045497019 creator A5037257708 @default.
• W2045497019 creator A5038754588 @default.
• W2045497019 creator A5053837408 @default.
• W2045497019 creator A5083809568 @default.
• W2045497019 date "2010-11-01" @default.
• W2045497019 modified "2023-10-18" @default.
• W2045497019 title "Recent developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking" @default.
• W2045497019 cites W1964958541 @default.
• W2045497019 cites W2106546601 @default.
• W2045497019 cites W2166549182 @default.
• W2045497019 cites W4239250096 @default.
• W2045497019 doi "https://doi.org/10.1109/3dic.2010.5751454" @default.
• W2045497019 hasPublicationYear "2010" @default.
• W2045497019 type Work @default.
• W2045497019 sameAs 2045497019 @default.
• W2045497019 citedByCount "16" @default.
• W2045497019 countsByYear W20454970192013 @default.
• W2045497019 countsByYear W20454970192014 @default.
• W2045497019 countsByYear W20454970192016 @default.
• W2045497019 countsByYear W20454970192017 @default.
• W2045497019 countsByYear W20454970192020 @default.
• W2045497019 countsByYear W20454970192021 @default.
• W2045497019 countsByYear W20454970192022 @default.
• W2045497019 countsByYear W20454970192023 @default.
• W2045497019 crossrefType "proceedings-article" @default.
• W2045497019 hasAuthorship W2045497019A5004087886 @default.
• W2045497019 hasAuthorship W2045497019A5006386276 @default.
• W2045497019 hasAuthorship W2045497019A5007776830 @default.
• W2045497019 hasAuthorship W2045497019A5007784067 @default.
• W2045497019 hasAuthorship W2045497019A5008648057 @default.
• W2045497019 hasAuthorship W2045497019A5010370732 @default.
• W2045497019 hasAuthorship W2045497019A5023518662 @default.
• W2045497019 hasAuthorship W2045497019A5026052355 @default.
• W2045497019 hasAuthorship W2045497019A5033364386 @default.
• W2045497019 hasAuthorship W2045497019A5037257708 @default.
• W2045497019 hasAuthorship W2045497019A5038754588 @default.
• W2045497019 hasAuthorship W2045497019A5053837408 @default.
• W2045497019 hasAuthorship W2045497019A5083809568 @default.
• W2045497019 hasConcept C127413603 @default.
• W2045497019 hasConcept C138113353 @default.
• W2045497019 hasConcept C159985019 @default.
• W2045497019 hasConcept C160671074 @default.
• W2045497019 hasConcept C178790620 @default.
• W2045497019 hasConcept C180088628 @default.
• W2045497019 hasConcept C185592680 @default.
• W2045497019 hasConcept C191897082 @default.
• W2045497019 hasConcept C192562407 @default.
• W2045497019 hasConcept C201414436 @default.
• W2045497019 hasConcept C201845621 @default.
• W2045497019 hasConcept C24326235 @default.
• W2045497019 hasConcept C2777855556 @default.
• W2045497019 hasConcept C2779133538 @default.
• W2045497019 hasConcept C2779227376 @default.
• W2045497019 hasConcept C33347731 @default.
• W2045497019 hasConcept C49040817 @default.
• W2045497019 hasConcept C530198007 @default.
• W2045497019 hasConcept C544778455 @default.
• W2045497019 hasConcept C59088047 @default.
• W2045497019 hasConceptScore W2045497019C127413603 @default.
• W2045497019 hasConceptScore W2045497019C138113353 @default.
• W2045497019 hasConceptScore W2045497019C159985019 @default.
• W2045497019 hasConceptScore W2045497019C160671074 @default.
• W2045497019 hasConceptScore W2045497019C178790620 @default.
• W2045497019 hasConceptScore W2045497019C180088628 @default.
• W2045497019 hasConceptScore W2045497019C185592680 @default.
• W2045497019 hasConceptScore W2045497019C191897082 @default.
• W2045497019 hasConceptScore W2045497019C192562407 @default.
• W2045497019 hasConceptScore W2045497019C201414436 @default.
• W2045497019 hasConceptScore W2045497019C201845621 @default.
• W2045497019 hasConceptScore W2045497019C24326235 @default.
• W2045497019 hasConceptScore W2045497019C2777855556 @default.
• W2045497019 hasConceptScore W2045497019C2779133538 @default.
• W2045497019 hasConceptScore W2045497019C2779227376 @default.
• W2045497019 hasConceptScore W2045497019C33347731 @default.
• W2045497019 hasConceptScore W2045497019C49040817 @default.
• W2045497019 hasConceptScore W2045497019C530198007 @default.
• W2045497019 hasConceptScore W2045497019C544778455 @default.
• W2045497019 hasConceptScore W2045497019C59088047 @default.
• W2045497019 hasLocation W20454970191 @default.
• W2045497019 hasOpenAccess W2045497019 @default.
• W2045497019 hasPrimaryLocation W20454970191 @default.
• W2045497019 hasRelatedWork W2034467675 @default.
• W2045497019 hasRelatedWork W2139841036 @default.
• W2045497019 hasRelatedWork W2157995048 @default.
• W2045497019 hasRelatedWork W2532494584 @default.
• W2045497019 hasRelatedWork W2544159966 @default.
• W2045497019 hasRelatedWork W2978362045 @default.
• W2045497019 hasRelatedWork W3085515726 @default.
• W2045497019 hasRelatedWork W4385525494 @default.

• next