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• W2045562555 abstract "It is shown how double exposure laser speckle photography, when used with an automatic image processing system, can provide detailed information on both in-plane displacement components around the tip of a crack. This paper describes the results of the analysis of six speckle photographs of sharp cracks in polymethylmethacrylate (PMMA), each on a mesh of 16 × 16 datapoints. Two numerical methods for calculation of the mode I stress intensity factor (KI) from the measured displacement field have been investigated. Least-squares fitting of the theoretical displacement field gave good estimates of KI, with low systematic and random errors (~1%). Evaluation of the J-integral around square paths enclosing the crack tip was found to result in larger errors (up to 5%). It is thought that laser speckle photography together with J-integral calculations may find applications in nondestructive testing, as a method of automatically detecting the presence of a crack." @default.
• W2045562555 created "2016-06-24" @default.
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• W2045562555 date "1988-01-01" @default.
• W2045562555 modified "2023-09-23" @default.
• W2045562555 title "Measurement of crack tip displacement field using laser speckle photography" @default.
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• W2045562555 doi "https://doi.org/10.1016/0013-7944(88)90139-7" @default.
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