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- W2045666907 abstract "The initial stage of stress-induced migration in aluminum interconnections on semiconductor devices was studied through measurements of the electric resistivity and the residual-stress, as well as observations of grain growth during high temperature storage. It was shown that characteristics of the initial stage varied markedly depending on the storage temperature and period. The variation of the characteristics was affected not only by (1) increase in grain size or decrease in dislocation density upon recrystallization, but also by (2) degeneration at the grain boundary in the aluminum interconnection, which was considered to be a pile-up of dislocations. In this paper, we propose a model that the initial stage of the stress-induced migration is determined by competition between phenomena (1) and (2), and discuss the possibility that the open failure rate of the interconnection is correlated qualitatively with the change in the electrical resistivity at the initial stage." @default.
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- W2045666907 title "Initial Stage of Stress-Induced Migration Phenomenon in Aluminum Interconnection on Semiconductor Device" @default.
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- W2045666907 doi "https://doi.org/10.1143/jjap.36.2601" @default.
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