Matches in SemOpenAlex for { <https://semopenalex.org/work/W2045987422> ?p ?o ?g. }
Showing items 1 to 74 of
74
with 100 items per page.
- W2045987422 abstract "This paper discusses an on-going research effort to investigate planarization strategies capable of meeting next generation high density package performance and cost requirements. The approach entails the development of an ultra-high removal rate (∼15 μm/min) copper CMP process used in the fabrication of package substrate inter-connects. Initial slurry recycling feasibility has also been investigated as part of the strategy to further reduce operating costs. A recent key thrust in advanced packaging interconnects necessitates the use of damascene-like processing techniques to fabricate build-up substrate layers having high-aspect ratio conductor traces. Inherent thickness variations resulting from the feature forming and copper electroplating processes require subsequent planarization to preserve design requirements for critical trace and ground plane uniformities. The removal rates that have been achieved are nearly one order of magnitude greater than any known ‘high removal rate’ copper slurries commercially available today. Slurry re-use feasibility evaluations were performed using a series of tests designed to characterize the slurry solubility limits. Preliminary data collection indicates promising results for recirculation/recycling of copper slurries without compromise of removal rate stability. CMP process modeling using CAD simulation tools have been shown to be successful in validating the slurry recirculation model with the experimental polish data collected." @default.
- W2045987422 created "2016-06-24" @default.
- W2045987422 creator A5014400660 @default.
- W2045987422 creator A5044584364 @default.
- W2045987422 creator A5044810606 @default.
- W2045987422 creator A5052571310 @default.
- W2045987422 creator A5070533250 @default.
- W2045987422 date "2005-01-01" @default.
- W2045987422 modified "2023-09-23" @default.
- W2045987422 title "A Paradigm Shift in the Development of Chemical Mechanical Polishing (CMP): Cost-Effective CMP Planarization in Next Generation Substrate/Package Design and Manufacturing" @default.
- W2045987422 doi "https://doi.org/10.1115/ipack2005-73371" @default.
- W2045987422 hasPublicationYear "2005" @default.
- W2045987422 type Work @default.
- W2045987422 sameAs 2045987422 @default.
- W2045987422 citedByCount "0" @default.
- W2045987422 crossrefType "proceedings-article" @default.
- W2045987422 hasAuthorship W2045987422A5014400660 @default.
- W2045987422 hasAuthorship W2045987422A5044584364 @default.
- W2045987422 hasAuthorship W2045987422A5044810606 @default.
- W2045987422 hasAuthorship W2045987422A5052571310 @default.
- W2045987422 hasAuthorship W2045987422A5070533250 @default.
- W2045987422 hasConcept C111368507 @default.
- W2045987422 hasConcept C116372231 @default.
- W2045987422 hasConcept C127313418 @default.
- W2045987422 hasConcept C127413603 @default.
- W2045987422 hasConcept C136525101 @default.
- W2045987422 hasConcept C138113353 @default.
- W2045987422 hasConcept C142724271 @default.
- W2045987422 hasConcept C159985019 @default.
- W2045987422 hasConcept C180088628 @default.
- W2045987422 hasConcept C191897082 @default.
- W2045987422 hasConcept C192562407 @default.
- W2045987422 hasConcept C199639397 @default.
- W2045987422 hasConcept C204787440 @default.
- W2045987422 hasConcept C21880701 @default.
- W2045987422 hasConcept C2777289219 @default.
- W2045987422 hasConcept C544778455 @default.
- W2045987422 hasConcept C71924100 @default.
- W2045987422 hasConcept C94293008 @default.
- W2045987422 hasConceptScore W2045987422C111368507 @default.
- W2045987422 hasConceptScore W2045987422C116372231 @default.
- W2045987422 hasConceptScore W2045987422C127313418 @default.
- W2045987422 hasConceptScore W2045987422C127413603 @default.
- W2045987422 hasConceptScore W2045987422C136525101 @default.
- W2045987422 hasConceptScore W2045987422C138113353 @default.
- W2045987422 hasConceptScore W2045987422C142724271 @default.
- W2045987422 hasConceptScore W2045987422C159985019 @default.
- W2045987422 hasConceptScore W2045987422C180088628 @default.
- W2045987422 hasConceptScore W2045987422C191897082 @default.
- W2045987422 hasConceptScore W2045987422C192562407 @default.
- W2045987422 hasConceptScore W2045987422C199639397 @default.
- W2045987422 hasConceptScore W2045987422C204787440 @default.
- W2045987422 hasConceptScore W2045987422C21880701 @default.
- W2045987422 hasConceptScore W2045987422C2777289219 @default.
- W2045987422 hasConceptScore W2045987422C544778455 @default.
- W2045987422 hasConceptScore W2045987422C71924100 @default.
- W2045987422 hasConceptScore W2045987422C94293008 @default.
- W2045987422 hasLocation W20459874221 @default.
- W2045987422 hasOpenAccess W2045987422 @default.
- W2045987422 hasPrimaryLocation W20459874221 @default.
- W2045987422 hasRelatedWork W1995265102 @default.
- W2045987422 hasRelatedWork W2011058469 @default.
- W2045987422 hasRelatedWork W2056574214 @default.
- W2045987422 hasRelatedWork W2062135041 @default.
- W2045987422 hasRelatedWork W2124573300 @default.
- W2045987422 hasRelatedWork W2182869943 @default.
- W2045987422 hasRelatedWork W2366050857 @default.
- W2045987422 hasRelatedWork W2390231680 @default.
- W2045987422 hasRelatedWork W2940858272 @default.
- W2045987422 hasRelatedWork W4230485264 @default.
- W2045987422 isParatext "false" @default.
- W2045987422 isRetracted "false" @default.
- W2045987422 magId "2045987422" @default.
- W2045987422 workType "article" @default.