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• W2046190916 abstract "This paper presents an proximity IOs using inductive coupling, namely ThruChip Interface (TCI). TCI employs near field inductive coupling that is suitable for high-density parallel channel arrangement with small cross talk. It is less expensive than TSV by over 20¢/chip, since it is implemented by digital circuits in a standard CMOS. It bears comparison with TSV in terms of data rate (10Gb/s/ch), reliability (BER<10–14), and energy dissipation (0.1pJ/b). ESD protection devices can be eliminated to lower delay, power, and area. It provides with an AC coupling link to make interface design easy under multiple/variable VDD's. The cost/performance will further be improved exponentially by thinning chip thickness. This paper will cover basics, applications, and future perspectives of the TCI." @default.
• W2046190916 created "2016-06-24" @default.
• W2046190916 creator A5073154009 @default.
• W2046190916 date "2011-11-01" @default.
• W2046190916 modified "2023-09-25" @default.
• W2046190916 title "Proximity IOs using inductive coupling" @default.
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• W2046190916 doi "https://doi.org/10.1109/rfit.2011.6141767" @default.
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