Matches in SemOpenAlex for { <https://semopenalex.org/work/W2046480456> ?p ?o ?g. }
Showing items 1 to 86 of
86
with 100 items per page.
- W2046480456 endingPage "17" @default.
- W2046480456 startingPage "11" @default.
- W2046480456 abstract "Purpose The purpose of this paper is to present a novel Sn7In4.1Ag0.5Cu/Plastic Core Solder Ball/Sn4Ag0.5Cu composite solder joint configuration for second‐level ball grid array (BGA) interconnections of low temperature co‐fired ceramic (LTCC) modules and the thermal fatigue durability of the configuration. The purpose of using the Sn7In4.1Ag0.5Cu solder was to increase the creep/fatigue resistance of critical regions on the LTCC side of the joint. Design/methodology/approach Test LTCC module/printed wiring board (PWB) assemblies were fabricated and exposed into temperature cycling tests over the 0 to 100°C and −40 to 125°C temperature ranges. The characteristic lifetimes of these assemblies were determined using DC resistance measurements. The failure mechanisms of the test assemblies were verified using scanning acoustic microscopy, FE‐SEM, and SEM investigation. Findings The test assemblies were exposed to thermal cycling tests (TCT) over test ranges of 0 to 100°C and −40 to 125°C, and characteristic lifetimes of over 5,500 and 1,400 cycles, respectively, were achieved. Compared with Sn4Ag0.5Cu/plastic‐core solder balls (PCSB)/Sn4Ag0.5Cu joints, the characteristic lifetime of the SAC‐In/PCSB/SAC joints increased over 55 per cent in the harsh (−40 to 125°C) TCT conditions. In the milder test conditions (0 to 100°C), the characteristic lifetime of the SAC‐In/PCSB/SAC joints increased 30 per cent compared with the SAC/PCSB/SAC joints. Originality/value The results proved that the enhanced creep/fatigue properties of the solder matrix resulted in satisfactory lifetime durations in the present lead‐free composite solder joints and, consequently, different primary failure mechanisms on the LTCC side due to the use of indium alloyed solder. Thus, the present joint configuration is assumed to be a promising solution for the further design of a reliable second‐level solder interconnection in LTCC/PWB assemblies with a high‐global thermal mismatch." @default.
- W2046480456 created "2016-06-24" @default.
- W2046480456 creator A5033747725 @default.
- W2046480456 creator A5040325023 @default.
- W2046480456 creator A5050482342 @default.
- W2046480456 creator A5067417912 @default.
- W2046480456 date "2008-06-27" @default.
- W2046480456 modified "2023-10-14" @default.
- W2046480456 title "Characterization of Sn7In4.1Ag0.5Cu solder in lead‐free composite solder joints of LTCC/PWB assembly" @default.
- W2046480456 cites W1977535809 @default.
- W2046480456 cites W2000044955 @default.
- W2046480456 cites W2041889508 @default.
- W2046480456 cites W2059866069 @default.
- W2046480456 cites W2078978940 @default.
- W2046480456 cites W2079733852 @default.
- W2046480456 cites W2092467391 @default.
- W2046480456 cites W2093629485 @default.
- W2046480456 cites W2126512568 @default.
- W2046480456 cites W2131494099 @default.
- W2046480456 doi "https://doi.org/10.1108/09540910810885679" @default.
- W2046480456 hasPublicationYear "2008" @default.
- W2046480456 type Work @default.
- W2046480456 sameAs 2046480456 @default.
- W2046480456 citedByCount "10" @default.
- W2046480456 countsByYear W20464804562012 @default.
- W2046480456 countsByYear W20464804562014 @default.
- W2046480456 countsByYear W20464804562019 @default.
- W2046480456 countsByYear W20464804562022 @default.
- W2046480456 crossrefType "journal-article" @default.
- W2046480456 hasAuthorship W2046480456A5033747725 @default.
- W2046480456 hasAuthorship W2046480456A5040325023 @default.
- W2046480456 hasAuthorship W2046480456A5050482342 @default.
- W2046480456 hasAuthorship W2046480456A5067417912 @default.
- W2046480456 hasConcept C119599485 @default.
- W2046480456 hasConcept C120793396 @default.
- W2046480456 hasConcept C121332964 @default.
- W2046480456 hasConcept C127413603 @default.
- W2046480456 hasConcept C134132462 @default.
- W2046480456 hasConcept C149912024 @default.
- W2046480456 hasConcept C153294291 @default.
- W2046480456 hasConcept C159985019 @default.
- W2046480456 hasConcept C177564732 @default.
- W2046480456 hasConcept C18555067 @default.
- W2046480456 hasConcept C191281628 @default.
- W2046480456 hasConcept C192562407 @default.
- W2046480456 hasConcept C204530211 @default.
- W2046480456 hasConcept C50296614 @default.
- W2046480456 hasConcept C66938386 @default.
- W2046480456 hasConcept C94709252 @default.
- W2046480456 hasConceptScore W2046480456C119599485 @default.
- W2046480456 hasConceptScore W2046480456C120793396 @default.
- W2046480456 hasConceptScore W2046480456C121332964 @default.
- W2046480456 hasConceptScore W2046480456C127413603 @default.
- W2046480456 hasConceptScore W2046480456C134132462 @default.
- W2046480456 hasConceptScore W2046480456C149912024 @default.
- W2046480456 hasConceptScore W2046480456C153294291 @default.
- W2046480456 hasConceptScore W2046480456C159985019 @default.
- W2046480456 hasConceptScore W2046480456C177564732 @default.
- W2046480456 hasConceptScore W2046480456C18555067 @default.
- W2046480456 hasConceptScore W2046480456C191281628 @default.
- W2046480456 hasConceptScore W2046480456C192562407 @default.
- W2046480456 hasConceptScore W2046480456C204530211 @default.
- W2046480456 hasConceptScore W2046480456C50296614 @default.
- W2046480456 hasConceptScore W2046480456C66938386 @default.
- W2046480456 hasConceptScore W2046480456C94709252 @default.
- W2046480456 hasIssue "3" @default.
- W2046480456 hasLocation W20464804561 @default.
- W2046480456 hasOpenAccess W2046480456 @default.
- W2046480456 hasPrimaryLocation W20464804561 @default.
- W2046480456 hasRelatedWork W1977652399 @default.
- W2046480456 hasRelatedWork W1998383453 @default.
- W2046480456 hasRelatedWork W2029236825 @default.
- W2046480456 hasRelatedWork W2046480456 @default.
- W2046480456 hasRelatedWork W2061185647 @default.
- W2046480456 hasRelatedWork W2143764895 @default.
- W2046480456 hasRelatedWork W2158226361 @default.
- W2046480456 hasRelatedWork W2165304696 @default.
- W2046480456 hasRelatedWork W2540374487 @default.
- W2046480456 hasRelatedWork W4385525325 @default.
- W2046480456 hasVolume "20" @default.
- W2046480456 isParatext "false" @default.
- W2046480456 isRetracted "false" @default.
- W2046480456 magId "2046480456" @default.
- W2046480456 workType "article" @default.