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- W2046773039 abstract "Optical interconnection technology for optical interboard and interchip connections will be an important technology in the next-generation communication equipment seeking a high-capacity throughput at the terabit per second level. With the objective of establishing an economical optical packaging technology, we propose an “optical I/O chip package,” which is an optical package for the hybrid integration of optoelectric (O/E) devices and LSI chips that can be mounted on a printed-circuit board by standard surface mount technology (SMT). In this paper, we propose the OptoBump interface as the optical interconnection between the optical package and the board that connects these two elements by forming the microlens on both and using collimated light. Accommodating the fibers on the board and connecting the connectors become unnecessary because the connections having large beam diameters are able to tolerate offsets in the SMT mounting position. First, we calculated the required collimated beam diameter of 104 µm under the assumption of an SMT accuracy of ±50 µm. Next, we applied ray tracing to estimate the optical losses of the 45° mirror at the polymer optical waveguide facet integrated into the printed-circuit substrate and clearly exhibited the incident beam conditions with both improved losses and tolerances. And we integrated the polymer microlens into the polymer optical waveguide and the surface-emitting laser (VCSEL) and experimentally evaluated the optical coupling performance between them. The results verified a 1-dB tolerance at ±50 µm and demonstrated the effectiveness of this proposal. © 2002 Wiley Periodicals, Inc. Electron Comm Jpn Pt 2, 86(1): 1–8, 2003; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/ecjb.10025" @default.
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- W2046773039 date "2002-12-13" @default.
- W2046773039 modified "2023-09-27" @default.
- W2046773039 title "Large-tolerant ?OptoBump? interface for interchip optical interconnections" @default.
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- W2046773039 doi "https://doi.org/10.1002/ecjb.10025" @default.
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