Matches in SemOpenAlex for { <https://semopenalex.org/work/W2047156249> ?p ?o ?g. }
Showing items 1 to 78 of
78
with 100 items per page.
- W2047156249 abstract "Microprocessors continue to grow in capabilities, complexity and performance. The current generation of microprocessors integrates functional components such as logic and level two (L2) cache memory into the microprocessor architecture. The functional integration of the microprocessor has resulted in better performance of the microprocessor as the clock speed has increased and the instruction execution time has decreased. However, the integration has introduced a layer of complexity to the thermal design and management of microprocessors. As a direct result of function integration, the power map on a microprocessor is highly non-uniform and the assumption of a uniform heat flux across the chip surface is not valid. The objective of this paper is to minimize the thermal resistance of the package by optimizing the distribution of the uniformly powered functional blocks. In order to model the non-uniform power dissipation on the silicon chip, the chip surface area is divided into a 4 × 4 and 6×6 matrix with a matrix space representing a distinct functional block with a constant heat flux. Finally, using a FEM code, an optimization of the positioning of the functional blocks relative to each other was carried out in order to minimize the junction temperature Tj. This analysis has no constraints placed on the redistribution of functional blocks. The best possible Tjmax reduction could thus be found. In reality (and at a later date) constraints must be placed regarding the maximum separation of any 2 (or more) functional blocks to satisfy electrical timing and compute performance requirements. Design guidelines are then suggested regarding the thermal based optimal distribution for any number of functional blocks. The commercial finite element code ANSYS® is used for this analysis." @default.
- W2047156249 created "2016-06-24" @default.
- W2047156249 creator A5006524549 @default.
- W2047156249 creator A5010025306 @default.
- W2047156249 creator A5086108587 @default.
- W2047156249 creator A5086408351 @default.
- W2047156249 creator A5088834533 @default.
- W2047156249 date "2005-01-01" @default.
- W2047156249 modified "2023-09-23" @default.
- W2047156249 title "Thermal Based Optimization of Functional Block Distributions in a Non-Uniformly Powered Die" @default.
- W2047156249 cites W2157530492 @default.
- W2047156249 doi "https://doi.org/10.1115/ipack2005-73486" @default.
- W2047156249 hasPublicationYear "2005" @default.
- W2047156249 type Work @default.
- W2047156249 sameAs 2047156249 @default.
- W2047156249 citedByCount "12" @default.
- W2047156249 countsByYear W20471562492013 @default.
- W2047156249 crossrefType "proceedings-article" @default.
- W2047156249 hasAuthorship W2047156249A5006524549 @default.
- W2047156249 hasAuthorship W2047156249A5010025306 @default.
- W2047156249 hasAuthorship W2047156249A5086108587 @default.
- W2047156249 hasAuthorship W2047156249A5086408351 @default.
- W2047156249 hasAuthorship W2047156249A5088834533 @default.
- W2047156249 hasConcept C111919701 @default.
- W2047156249 hasConcept C115537543 @default.
- W2047156249 hasConcept C121332964 @default.
- W2047156249 hasConcept C127413603 @default.
- W2047156249 hasConcept C149635348 @default.
- W2047156249 hasConcept C163258240 @default.
- W2047156249 hasConcept C165005293 @default.
- W2047156249 hasConcept C167781694 @default.
- W2047156249 hasConcept C173608175 @default.
- W2047156249 hasConcept C178693496 @default.
- W2047156249 hasConcept C24326235 @default.
- W2047156249 hasConcept C2524010 @default.
- W2047156249 hasConcept C2777210771 @default.
- W2047156249 hasConcept C2780728072 @default.
- W2047156249 hasConcept C33923547 @default.
- W2047156249 hasConcept C41008148 @default.
- W2047156249 hasConcept C530198007 @default.
- W2047156249 hasConcept C62520636 @default.
- W2047156249 hasConcept C76155785 @default.
- W2047156249 hasConceptScore W2047156249C111919701 @default.
- W2047156249 hasConceptScore W2047156249C115537543 @default.
- W2047156249 hasConceptScore W2047156249C121332964 @default.
- W2047156249 hasConceptScore W2047156249C127413603 @default.
- W2047156249 hasConceptScore W2047156249C149635348 @default.
- W2047156249 hasConceptScore W2047156249C163258240 @default.
- W2047156249 hasConceptScore W2047156249C165005293 @default.
- W2047156249 hasConceptScore W2047156249C167781694 @default.
- W2047156249 hasConceptScore W2047156249C173608175 @default.
- W2047156249 hasConceptScore W2047156249C178693496 @default.
- W2047156249 hasConceptScore W2047156249C24326235 @default.
- W2047156249 hasConceptScore W2047156249C2524010 @default.
- W2047156249 hasConceptScore W2047156249C2777210771 @default.
- W2047156249 hasConceptScore W2047156249C2780728072 @default.
- W2047156249 hasConceptScore W2047156249C33923547 @default.
- W2047156249 hasConceptScore W2047156249C41008148 @default.
- W2047156249 hasConceptScore W2047156249C530198007 @default.
- W2047156249 hasConceptScore W2047156249C62520636 @default.
- W2047156249 hasConceptScore W2047156249C76155785 @default.
- W2047156249 hasLocation W20471562491 @default.
- W2047156249 hasOpenAccess W2047156249 @default.
- W2047156249 hasPrimaryLocation W20471562491 @default.
- W2047156249 hasRelatedWork W1558545464 @default.
- W2047156249 hasRelatedWork W1571368810 @default.
- W2047156249 hasRelatedWork W1784146144 @default.
- W2047156249 hasRelatedWork W2047156249 @default.
- W2047156249 hasRelatedWork W2112096947 @default.
- W2047156249 hasRelatedWork W2143408024 @default.
- W2047156249 hasRelatedWork W2372170743 @default.
- W2047156249 hasRelatedWork W2379400621 @default.
- W2047156249 hasRelatedWork W2473594952 @default.
- W2047156249 hasRelatedWork W2536291958 @default.
- W2047156249 isParatext "false" @default.
- W2047156249 isRetracted "false" @default.
- W2047156249 magId "2047156249" @default.
- W2047156249 workType "article" @default.