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- W2047369375 abstract "This paper describes a layout technique to alleviate soft failure for short pitch multi finger ggMOS devices. Forming metal path parallel to the finger achieved 17-30% improvement in soft failure current without area penalty. Improvement of heat dissipation parallel to the finger is a possible explanation for this phenomenon." @default.
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- W2047369375 date "2007-09-01" @default.
- W2047369375 modified "2023-10-17" @default.
- W2047369375 title "Layout technique to alleviate soft failure for short pitch multi finger ESD protection devices" @default.
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- W2047369375 doi "https://doi.org/10.1109/eosesd.2007.4401729" @default.
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