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- W2047817864 abstract "Sip/1199Al composites for electronic packaging applications with high volume fraction of Si particles were fabricated by squeeze-casting technology. The microstructure observation showed that the composites were dense and Si particles distributed uniformly; The linear CTEs of Sip/1199 composites was between (8.1∼12) × 10−6°C−1, and they were decreased with the increasing content of Si particles as well as annealing treatment; the thermal conductivity can reach 150W/ (m·°C), which was decreased with the increasing contents of Si particles as well as annealing treatment. The composites had excellent mechanical properties and also could be recycled." @default.
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- W2047817864 date "2008-07-01" @default.
- W2047817864 modified "2023-09-26" @default.
- W2047817864 title "Microstructure and properties of environmental-friendly Sip/1199Al composites used for electronic packaging" @default.
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- W2047817864 doi "https://doi.org/10.1109/icept.2008.4607091" @default.
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