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- W2048366995 abstract "This paper describes evaluation of the strength in Ag-Sn-jointed Si specimens heated by Al/Ni film’s exothermic reaction. The reaction generates heat enough to melt Ag-Sn film for soldering. To measure the strength, four-point micro-bending test technique has been developed. The rectangular-solid Si specimens having a Ag-Sn/AlNi/Ag-Sn section were prepared by dicing the bonded Si-wafer under various pressure loads. A higher pressure yielded a better contact condition between Al/Ni and Ag-Sn so that heat-conduction improved; consequently Ag-Sn was melted sufficiently. Al/Ni reactive film has a potential as a micro-heater in soldering for MEMS." @default.
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- W2048366995 date "2010-01-01" @default.
- W2048366995 modified "2023-09-27" @default.
- W2048366995 title "Al/Ni Self-Propagating Exothermic Film for MEMS Application" @default.
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- W2048366995 doi "https://doi.org/10.4028/www.scientific.net/msf.638-642.2142" @default.
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