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- W2048933090 abstract "The moisture absorption in fluorinated silicon oxide (SiOF) film was reduced by adding Ar during film deposition, thus the stability of the film was improved. The film was prepared by parallel plate plasma enhanced chemical vapor deposition by adding Ar into the deposition process of SiOF film using Si 2 H 6 , N 2 O. and CF 4 . The result of Fourier transform infrared spectroscopy showed that the Si-F peak intensity increased with Ar added; meanwhile, the relative Si-OH peak intensity decreased indicating less moisture absorption. As the result, the dielectric constant and leakage current of the SiOF film with Ar decreased compared with those of the SiOF film without Ar." @default.
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- W2048933090 date "1999-10-01" @default.
- W2048933090 modified "2023-10-16" @default.
- W2048933090 title "Improvement of Moisture Resistance in Fluoride Silicon Oxide Film by Adding Ar" @default.
- W2048933090 doi "https://doi.org/10.1149/1.1392553" @default.
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