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• W2049605280 endingPage "255305" @default.
• W2049605280 startingPage "255305" @default.
• W2049605280 abstract "We introduce using sputtered aluminum oxide (alumina) as a resilient etch mask for fluorinated silicon reactive ion etches. Achieving selectivity of 5000:1 for cryogenic silicon etching and 68:1 for SF6/C4F8 silicon etching, we employ this mask for fabrication of high-aspect-ratio silicon micropillars and nanopillars. Nanopillars with diameters ranging from below 50 nm up to several hundred nanometers are etched to heights greater than 2 µm. Micropillars of 5, 10, 20, and 50 µm diameters are etched to heights of over 150 µm with aspect ratios greater than 25. Processing and characterization of the sputtered alumina is also discussed." @default.
• W2049605280 created "2016-06-24" @default.
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• W2049605280 date "2009-06-02" @default.
• W2049605280 modified "2023-09-30" @default.
• W2049605280 title "Alumina etch masks for fabrication of high-aspect-ratio silicon micropillars and nanopillars" @default.
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• W2049605280 doi "https://doi.org/10.1088/0957-4484/20/25/255305" @default.
• W2049605280 hasPubMedId "https://pubmed.ncbi.nlm.nih.gov/19487807" @default.
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