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• W2050366819 startingPage "1583" @default.
• W2050366819 abstract "In order to investigate the fracture behavior of Sn–3.0Ag–0.5Cu solder bump, solder balls with the diameter of 0.76 mm were soldered on Cu pad in this study, then high speed impact test and static shear test of solder bumps were carried out to measure the joint strength of the soldering interface. The effect of isothermal aging on joint strength as well as fracture behavior of solder bumps was investigated, and the composition of the fracture surface was identified by means of EPMA. The results indicate that the fracture is inside the bulk solder in low speed shear test regardless of the aging effect, thus the maximum load reflects the solder strength rather than the interfacial strength. It is also found that under 1 m/s impact loading, the crack initiation position is changed from solder/Cu6Sn5 interface to Cu3Sn/Cu interface after long time isothermal aging, and the fracture occurs inside the bulk solder accompanying with intermetallic compound in both of the as-soldered and aged joints. The thickened multiple IMC layers during isothermal aging account for the degraded impact resistance, and the change of the solder matrix is another factor for reduced impact resistance owing to Sn residue on the fracture surface." @default.
• W2050366819 created "2016-06-24" @default.
• W2050366819 creator A5075424520 @default.
• W2050366819 creator A5089636779 @default.
• W2050366819 date "2014-08-01" @default.
• W2050366819 modified "2023-09-27" @default.
• W2050366819 title "Impact strength of Sn–3.0Ag–0.5Cu solder bumps during isothermal aging" @default.
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• W2050366819 doi "https://doi.org/10.1016/j.microrel.2014.03.007" @default.
• W2050366819 hasPublicationYear "2014" @default.
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