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- W2050643754 abstract "Abstract The DC performance of Cu-based GaAs MESFETs with Au/Cu/Ti and Cu TiW metallized gates has been characterized after accelerated stress testing up to 250°C and anneals of 1000 hours. A failure mode has been shown to result in a decrease in IDSS, gm and VP and an increase in channel resistance as a function of annealing temperatures. Back-etch results show that the gate Cu/TiW/GaAs has less interfacial degradation than Cu/Ti/GaAs gate, which is in agreement with DC measurement. However, the obvious oxidation of Cu overlayer after 250°C anneal was found, which leads to a large increase in gate resistance, further causes the apparent degradation of device performance for the devices with the exposed Cu TiW gate." @default.
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- W2050643754 date "1997-10-01" @default.
- W2050643754 modified "2023-09-27" @default.
- W2050643754 title "Failure mechanisms of GaAs mesfets with Cu/refractory metallized gates" @default.
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- W2050643754 doi "https://doi.org/10.1016/s0026-2714(97)00143-1" @default.
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