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• W2051290082 abstract "In this work it is described an high-density contacting technology that can replace wire bonding in power electronic applications, to overcome known limitation of bond wires liftoff occurring after several power cycles due to the difference in the coefficient of thermal expansion of silicon and aluminum. In the presented technology, MEMS (micro-electro-mechanics systems) micro-fabrication processes are used to realize contact structures that, pressed against the silicon dice, provide a reliable compliant contact. One advantage of this technology is that the contacts can be hosted on a printed circuit board that integrates the control circuitry for the power devices. This will reduce the footprint of power systems, like Integrated High Power Modules (IHPM). Reduced footprints are beneficial in applications where space is a concern, like the automotive industry. The description of the technological steps for building the contacting assembly is reported together with process conditions and electrical performances of two test structures." @default.
• W2051290082 created "2016-06-24" @default.
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• W2051290082 date "2012-05-01" @default.
• W2051290082 modified "2023-10-14" @default.
• W2051290082 title "High density compliant contacting technology for integrated high power modules in automotive applications" @default.
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• W2051290082 doi "https://doi.org/10.1109/ectc.2012.6249111" @default.
• W2051290082 hasPublicationYear "2012" @default.
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