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• W2051292201 endingPage "145701" @default.
• W2051292201 startingPage "145701" @default.
• W2051292201 abstract "Nanocrystalline metals demonstrate a range of fascinating properties, including high levels of mechanical strength. However, as these materials are exposed to high temperatures, it is critical to determine the grain size evolution, as this process can drastically change the mechanical properties. In this work, nanocrystalline sputtered Cu thin films with 43 +/- 2 nm grain size were produced by dc-magnetron sputtering. Specimens were subsequently annealed in situ in a transmission electron microscope at 100, 300 and 500 degrees C. Not only was grain growth more evident at 500 degrees C but also the fraction of twins found. An analysis of grain growth kinetics revealed a time exponent of 3 and activation energy of 35 kJ mol(-1). This value is explained by the high energy stored in the form of dislocation, grain boundaries and twin boundaries existing in nanocrystalline copper, as well as the high probability for atoms to move across grains in nanocrystalline materials." @default.
• W2051292201 created "2016-06-24" @default.
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• W2051292201 date "2010-03-10" @default.
• W2051292201 modified "2023-09-23" @default.
• W2051292201 title "<i>In situ</i>TEM study of grain growth in nanocrystalline copper thin films" @default.
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• W2051292201 doi "https://doi.org/10.1088/0957-4484/21/14/145701" @default.
• W2051292201 hasPubMedId "https://pubmed.ncbi.nlm.nih.gov/20215662" @default.
• W2051292201 hasPublicationYear "2010" @default.
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