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- W2051971802 abstract "CdTe 멀티에너지 X선 영상센서와 ROIC를 패키징 하기 위한 flip chip bump bonding, Au wire bonding 및 encapsulation 공정조건을 개발하였으며 성공적으로 모듈화 하였다. 최적 flip chip bonding 공정 조건은 접합온도 CdTe 센서 <TEX>$150^{circ}C$</TEX>, ROIC <TEX>$270^{circ}C$</TEX>, 접합압력 24.5N, 접합시간 30s일 때이다. ROIC에 형성된 SnAg bump의 bonding이 용이하도록 CdTe 센서에 비하여 상대적으로 높은 접합온도를 설정하였으며, CdTe센서가 실리콘 센서에 비하여 쉽게 파손되는 것을 고려하여 접합압력을 최소화하였다. 패키징 완료된 CdTe 멀티에너지 X선 모듈의 각각 픽셀들은 단락이나 합선 등의 전기적인 문제점이 없는 것을 X선 3D computed tomography를 통해 확인할 수 있었다. 또한 Flip chip bump bonding후 전단력은 <TEX>$2.45kgf/mm^2$</TEX> 로 측정되었으며, 이는 기준치인 <TEX>$2kgf/mm^2$</TEX> 이상으로 충분한 접합강도를 가짐을 확인하였다. The process of flip-chip bump bonding, Au wire bonding and encapsulation were sucessfully developed and modularized. The CdTe sensor and ROIC were optimally jointed together at <TEX>$150^{circ}C$</TEX> and <TEX>$270^{circ}C$</TEX> respectively under24.5 N for 30s. To make SnAg bump on ROIC easy to be bonded, the higher bonding temperature was established than CdTe sensor's. In addition, the bonding pressure was lowered minimally because CdTe Sensor is easier to break than Si Sensor. CdTe multi-energy sensor module observed were no electrical failures in the joints using developed flip chip bump bonding and Au wire bonding process. As a result of measurement, shearing force was <TEX>$2.45kgf/mm^2$</TEX> and, it is enough bonding force against threshold force, <TEX>$2kgf/mm^2s$</TEX>." @default.
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- W2051971802 date "2014-12-30" @default.
- W2051971802 modified "2023-10-14" @default.
- W2051971802 title "Development of Packaging Technology for CdTe Multi-Energy X-ray Image Sensor" @default.
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- W2051971802 doi "https://doi.org/10.7742/jksr.2014.8.7.371" @default.
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