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- W2052356061 abstract "The work reported here is concerned with using a chemically amplified, positive tone, alkaline developable photoresist for patterning 0.3 - 0.5 (mu) features by exposing with monochromatic light at (lambda) equals 248 nm. More specifically, this class of materials employs tertiarybutoxycarbonyl (t-BOC) protected polyhydroxystyrenesulfone polymer and typically a nitrobenzyl ester photo acid generator, usually referred to as the CAMP resist. Since the lithographic performance of these materials has been already reported, the emphasis of this work falls on the pattern transfer and especially the dry etching/resist stripping steps. As a matter of reference, only an example of the lithographic performance is shown, indicating the starting point for the plasma etching work." @default.
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- W2052356061 date "1992-06-01" @default.
- W2052356061 modified "2023-09-23" @default.
- W2052356061 title "Pattern transfer capabilities of CAMP deep-UV resist" @default.
- W2052356061 doi "https://doi.org/10.1117/12.59748" @default.
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