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- W2053088114 abstract "Integration challenges of porous ultra low-k (ULK) materials resulting from the ULKs' high sensitivity to process damage constitute a major roadblock to their implementation in back-end-of-the-line wiring structures for advanced technology nodes. The Post Porosity Plasma Protection strategy, which we introduced last year, enables to shield the ULKs' porosity during key integration steps. We report here on the feasibility of the protection across a wider range of dielectric constants and the advantages offered by our strategy during integration in terms of critical dimension integrity and electrical properties." @default.
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- W2053088114 date "2012-06-01" @default.
- W2053088114 modified "2023-10-18" @default.
- W2053088114 title "Post Porosity Plasma Protection applied to a wide range of ultra low-k materials" @default.
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- W2053088114 doi "https://doi.org/10.1109/iitc.2012.6251565" @default.
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