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- W2053171806 abstract "Triple junctions involving twin boundaries in Cu interconnects of integrated circuits have been shown to be potentially detrimental to the manufacturability of the circuit. Microstructures of annealed Cu films are dependent on film thickness and deposition parameters. This work describes texture and twin boundary development in sputtered and annealed Cu films." @default.
- W2053171806 created "2016-06-24" @default.
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- W2053171806 date "2006-03-01" @default.
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- W2053171806 title "Predicting thickness dependent twin boundary formation in sputtered Cu films" @default.
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- W2053171806 doi "https://doi.org/10.1016/j.scriptamat.2005.11.041" @default.
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