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- W2053483069 abstract "Challenges of lithography performance, dry etch resistance, and substrate dependency in resist materials dedicated tonegative tone development (NTD) process were studied. The gamma-parameter in contrast curve was increased toachieve improvement in lithography performances, and CD-uniformity (CDU), DOF, and circularity of dense C/Hpattern were studied for the resist material. Ohnishi-parameter of de-protected polymer was decreased to improve dryetch resistance, and dissolution property and lithography performance were studied to look at maturity of materials.Formulation dependency on pattern collapse property on spin-on-type Si-hard mask (Si-HM) were studied, and materialproperty to suppress pattern collapse was discussed." @default.
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- W2053483069 date "2012-03-29" @default.
- W2053483069 modified "2023-09-23" @default.
- W2053483069 title "Functional resist materials for negative tone development in advanced lithography" @default.
- W2053483069 doi "https://doi.org/10.1117/12.916281" @default.
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