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• W2054038236 abstract "A new solder alloy, intended to replace eutectic Sn–Pb, consists of the near eutectic alloy 93 wt-%Sn plus 7 wt-%Zn, with approximately 60 ppm Al added to prevent excessive oxidation of the Zn component. On solidification, this alloy forms a broken lamellar microstructure of Zn in Sn. This paper reports a study of the interaction of this alloy with two common substrate materials, copper and electroless nickel immersion gold (ENIG). Initial contact of the liquid solder on copper for 60 s at 215-230°C formed on the copper a 2 μm thick layer of a Cu–Zn intermetallic compound. After aging for 24 h at 150°C, this compound layer thickened to approximately 3·5 μm. In addition, two layers, each containing particles of a different Cu–Zn compound replacing the Zn, formed between the interface layer and the original solder. After 150 h at 150°C, the interface layer reached 4·5 μm in thickness and the two compound containing layers a total of 65 μm. These rapid microstructural changes correspond to both Cu and Zn being rapid diffusers in solid Sn. On an ENIG substrate, contact with the liquid solder for 60 s at 230°C formed a thin (0·2 μm) and somewhat irregular reaction layer, with a composition consisting of Au, Sn and Zn. Aging for a few hours produced no appreciable change. After 265 hours at 150°C, a continuous layer 0·2 μm thick, with composition now including Ni, was formed on the ENIG interface. After 500 h at 150°C, this thin layer remained and a 10 μm thick layer denuded in Zn had developed in the adjacent solder with accompanying formation of particles having the composition 90 wt-%Zn with Ni and Au on the thin interface layer. Aging to 1150 h produced a denuded zone 17 μm thick and continued growth of the Zn-rich particles. These observed reaction rates appear to correspond to diffusion rates of the order of self-diffusion of Sn at 150°C." @default.
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• W2054038236 date "2007-10-01" @default.
• W2054038236 modified "2023-10-17" @default.
• W2054038236 title "Formation of intermetallic compounds with Sn–Zn–Al solder on copper and electroless nickel–immersion gold substrates" @default.
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• W2054038236 doi "https://doi.org/10.1179/174328407x213314" @default.
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