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• W2054292037 abstract "The effects of SiF4 flow rate and deposition temperature on the physical properties and stability of fluorine-doped organo-silica-glass (OFSG) films were investigated. The porosity of the as-deposited OFSG dielectrics declines as the flow rate of SiF4 gas and the deposition temperature increase, increasing the dielectric constant. However, newly formed Si–F bonds have less electronic polarizability, reducing the dielectric constant. These traded-off properties yield a minimum dielectric constant of the OFSG film deposited at 250 °C with a SiF4 flow rate of 100 SCCM (SCCM denotes cubic centimeter per minute at STP). The stability of Si–F bonds in the OFSG films is related to the deposition conditions. OFSG films deposited a higher SiF4 flow rate (&gt;400 SCCM) or a lower deposition temperature (&lt;300 °C) have lower thermal stability and are less well protected against moisture because of the instability of Si–F bonds. Therefore, more attention should be paid to the conditions for depositing fluorine-doped OFSG dielectrics." @default.
• W2054292037 created "2016-06-24" @default.
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• W2054292037 date "2010-04-08" @default.
• W2054292037 modified "2023-09-26" @default.
• W2054292037 title "Effect of fluorine flow and deposition temperature on physical characteristics and stability of fluorine-doped siloxane-based low-dielectric-constant material" @default.
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• W2054292037 doi "https://doi.org/10.1116/1.3383402" @default.
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