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- W2055357039 abstract "The sidewall damage induced by reactive ion-beam etching (RIBE) with Cl 2 has been studied. The sidewall damage depth was estimated from the ion-beam-angle dependence, and the photoluminescence (PL) emitted from the etched sidewall of a GaInAsP/InP DH wafer was directly measured. The sidewall damage depth of an InP substrate was estimated as less than a few hundred angstroms at an extraction voltage of 400 V. The PL intensity from the sidewall of a GaInAsP/InP DH wafer decreased considerably after RIBE, compared with that of a cleaved facet. The deteriorated PL intensity was recovered remarkably through passivation with (NH 4 ) 2 S x ." @default.
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- W2055357039 date "1992-05-01" @default.
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- W2055357039 title "Characterization of Sidewall Damage Induced by Reactive Ion-Beam Etching" @default.
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- W2055357039 doi "https://doi.org/10.1143/jjap.31.1541" @default.
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