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• W2055543722 abstract "In this work, through-the-gate implantation (TGI) of channel- and well-doping is favorably combined with n + /p + gate implantation. This approach offers an additional degree of freedom to optimize dual-workfunction gates independently from the fabrication of ultra-shallow source/drain junctions. By using the same masks for each device type, no increase in process complexity occurs. In combination with the extended trench isolation gate technology (EXTIGATE) process architecture, a corner parasitics-free shallow trench isolation (STI) is provided together with the separation of pre-implanted n + /p + polySi areas to inhibit lateral n + /p + cross-diffusion during gate activation. Nitrogen co-implantation into the gate is implemented to suppress boron penetration and to provide relief from residual impurity cross-diffusion within the gate during S/D anneals. Besides high drive currents, excellent short channel-behavior and improved narrow width characteristics are obtained with TGI-CMOS." @default.
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• W2055543722 date "1999-04-01" @default.
• W2055543722 modified "2023-09-25" @default.
• W2055543722 title "Dual-Workfunction Gate Engineering in a Corner Parasitics-Free Shallow-Trench-Isolation Complementary-Metal-Oxide-Semiconductor Technology" @default.
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• W2055543722 doi "https://doi.org/10.1143/jjap.38.2232" @default.
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