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- W2055949423 abstract "A method has been developed to create vertically aligned carbon nanotube (VACNT) thermal interface materials that can be attached to a variety of metallized surfaces. VACNT films were grown on Si substrates using standard CVD processing followed by metallization using Ti/Au. The coated CNTs were then bonded to metallized substrates at 220 °C. By reducing the adhesion of the VACNTs to the growth substrate during synthesis, the CNTs can be completely transferred from the Si growth substrate and used as a die attachment material for electronic components. Thermal resistance measurements using a photoacoustic technique showed thermal resistances as low as 1.7 mm2 K W − 1 for bonded VACNT films 25–30 µm in length and 10 mm2 K W − 1 for CNTs up to 130 µm in length. Tensile testing demonstrated a die attachment strength of 40 N cm − 2 at room temperature. Overall, these metallized and bonded VACNT films demonstrate properties which are promising for next-generation thermal interface material applications." @default.
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- W2055949423 date "2010-10-08" @default.
- W2055949423 modified "2023-10-18" @default.
- W2055949423 title "A metallization and bonding approach for high performance carbon nanotube thermal interface materials" @default.
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- W2055949423 doi "https://doi.org/10.1088/0957-4484/21/44/445705" @default.
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