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- W2056054203 abstract "Latest developments in micro-electro-mechanical systems (MEMS) have paved the way to follow the more than Mooreapproach. Several key components, such as silicon pressure sensors have been developed using MEMS processingtechniques. Recently, MEMS technologies have been combined with standard CMOS processes and MEMS devices suchas microviscosimeters and RF-MEMS switches were successfully demonstrated. The most challenging part of thisMEMS process is the last long wet etch step, which remove the sacrificial layer to make the actuator moveable. Suchlong etch step is strongly influenced by the previous lithography steps. Especially the type of the photoresist has a stronginfluence on the performance of the final MEMS device. Here, we report a novel MEMS fabrication process, applied tothe back-end-off-line (BEOL) of a 0.25μm SiGe BiCMOS technology. The full MEMS process flow is explained and thelast lithography step is detailed. First, we show the influence of different substrate surface preconditions which definesthe adhesion between the photoresist and the substrate. The final 6μm thick photoresist layer is required for the criticalMEMS actuator release procedure due to the long wet etch process. In this wet etch process, a buffered hydrofluoric acidetchant penetrates the resist layer due to the long etch time (>80 min). Such penetration becomes more critical in the caseof low adhesion between the photoresist and the wafer surface. Improving the latter can be achieved by using differentprimers or dehydration bakes. Furthermore, a new approach of an alternative standard lithography process isinvestigated. For both studies, additional SEM cross sections and contact angle measurements is presented." @default.
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- W2056054203 date "2012-04-16" @default.
- W2056054203 modified "2023-09-23" @default.
- W2056054203 title "Lithographic aspects for the fabrication of BiCMOS embedded bio-MEMS and RF-MEMS" @default.
- W2056054203 doi "https://doi.org/10.1117/12.918021" @default.
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