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- W2056523263 abstract "In this paper, a dual-beam laser micromachining system consisting of a femtosecond (fs) laser and a nanosecond (ns)laser has been developed to enhance the ablation efficiency. Experiments were conducted in different materials includingdielectric (fused silica), semiconductor (silicon wafer), and metal (aluminum alloys). The amount of material beingremoved was determined for fs pulses alone, ns pulses alone, and pairs of fs and ns pulses with different time lags inbetween. It was found that the material removal efficiency increases in the dual-beam process for all materials beingstudied as compared to the fs alone or ns alone, particularly for dielectrics. The highest ablation efficiency for fusedsilica occurs when the fs pulse is shot near the peak of the ns pulse envelope. A corresponding numerical model for dualbeam ablation of dielectrics was also developed by integrating the plasma model, the improved two-temperature model,and Fourier's law to understand the laser-material interaction. It was found that the fs laser pulse can significantlyincrease the free electron density and change the optical properties of the dielectric, leading to the increase of absorptionfor the subsequent ns pulse energy. This study provides a fundamental understanding for the enhancement of materialablation efficiency, particularly for wide-bandgap dielectrics." @default.
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- W2056523263 date "2010-02-11" @default.
- W2056523263 modified "2023-09-26" @default.
- W2056523263 title "Enhancement of ablation efficiency by a femto/nano-second dual-beam micromachining system" @default.
- W2056523263 doi "https://doi.org/10.1117/12.842733" @default.
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