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- W2056553330 abstract "This study aims at the testing of various low-k insulators deposited at temperatures below approximately 160 °C for possible application in temperature-limited copper interconnects (e.g., in plastic electronics). Various polymers were tested such as the well-known poly(methyl methacrylate) (PMMA), a polyhedral oligomeric silsesquioxane (POSS) based copolymer partially fluorinated (POSS-F) and the newly synthesized poly(2,2,2-trifluoroethyl methacrylate) (PFEMA) and poly(dimethyl-siloxane) (PDMS). The above materials were compared with conventional spin-on glasses (SOGs), purchased from Filmtronics with respect to their handling (application, curing, mechanical strength, patterning) and dielectric constant. It was shown that organic polymers containing C-F bonds (PFEMA), Si-O bonds (PDMS) and Si-O and C-F bonds (POSS-F) present considerable advantages (related to the value of k and to handling) for use in Cu/low-k interconnects compared with usual SOGs cured at low temperatures." @default.
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- W2056553330 date "2005-01-01" @default.
- W2056553330 modified "2023-10-03" @default.
- W2056553330 title "Characterization of various low-<i>k</i>dielectrics for possible use in applications at temperatures below 160 °C" @default.
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- W2056553330 doi "https://doi.org/10.1088/1742-6596/10/1/054" @default.
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