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- W2056569285 abstract "Ni(Pt)/Si-cap/SiGe solid phase reaction with various Si cap layer thickness and Ge content has been investigated in this paper. The results suggest that the Si-cap layer needs to be carefully optimized to achieve the lowest sheet resistance (Rs). The thermal stability study shows that Ge atoms out-diffusion results in the strain relaxation and the decrease of Ge content of SiGe layer even after a low temperature post annealing, although the Rs apparently remain constant. After a higher temperature post annealing, the film agglomeration and Ge segregation cause a significant increase in Rs and decrease of compressive strain in SiGe layer." @default.
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- W2056569285 date "2014-05-01" @default.
- W2056569285 modified "2023-09-23" @default.
- W2056569285 title "Investigation of Ni(Pt)/Si-cap/SiGe solid phase reaction" @default.
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- W2056569285 doi "https://doi.org/10.1109/iwjt.2014.6842063" @default.
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