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- W2056574214 abstract "Sub micron silver lines are patterned by applying chemical mechanical polishing (CMP). Dry etched SiO2 trenches are filled with Ag by sputtering before removing surplus Ag by several CMP methods. Techniques using a slurry which focus on mechanical polishing have a problem in achieving planar removal of the metal. But with mainly chemical polishing a homogenous removal with proper embedded lines is possible. Thermally robust and smooth Ag metallization lines are the result of such a process." @default.
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- W2056574214 date "2002-10-01" @default.
- W2056574214 modified "2023-09-26" @default.
- W2056574214 title "Chemical mechanical polishing of silver damascene structures" @default.
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- W2056574214 doi "https://doi.org/10.1016/s0167-9317(02)00772-4" @default.
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