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• W2056674558 abstract "We report on the development of a 0.25 μm InP HBT technology suitable for integrated circuit demonstrations at the lower end of the THz frequency band (0.3-3THz). Transistors demonstrate an extrapolated f <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>max</sub> of >800 GHz while maintaining a common-emitter breakdown voltage (BV <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>CEO</sub> ) >4 V. The transistors have been integrated in a full IC process that includes three-levels of interconnects, backside wafer thinning to 50 μm with a through-wafer via process, and a backside etch singulation process that allows for the formation of free-standing integrated waveguide probes. The technology has been utilized to demonstrate amplifiers, fixed-frequency and voltage controlled oscillators and dynamic frequency dividers all operating at >300 GHz." @default.
• W2056674558 created "2016-06-24" @default.
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• W2056674558 date "2010-10-01" @default.
• W2056674558 modified "2023-09-30" @default.
• W2056674558 title "InP HBT Integrated Circuit Technology for Terahertz Frequencies" @default.
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• W2056674558 doi "https://doi.org/10.1109/csics.2010.5619675" @default.
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