Matches in SemOpenAlex for { <https://semopenalex.org/work/W2057090429> ?p ?o ?g. }
Showing items 1 to 86 of
86
with 100 items per page.
- W2057090429 endingPage "219" @default.
- W2057090429 startingPage "214" @default.
- W2057090429 abstract "TiN/TiSi2 bilayers offering excellent stability as a barrier against Cu metallization have been made achievable through a two-step rapid thermal conversion process. TiN/TiSi2 bilayers are formed on single-crystalline Si substrates by the thermal conversion of Ti films in an ammonia ambient, using a rapid thermal process with a sequential two-step temperature cycle. In the thermal conversion process, the first-step is conducted in a low-temperature range, to minimize Ti/Si interaction, while maintaining reasonable interaction of Ti/NH3 and vigorous nitrogen diffusion through the Ti layer, to maximize the thickness of the TiN layer. Then, the second step is carried out at a relatively high temperature, to reduce Ti/Si interaction in the silicidation process. The TiN/TiSi2 bilayers show excellent diffusion barriers between Cu and single-crystal Si up to the annealing condition, 800°C for 90 s; and the Cu film improve in quality by resulting from grain growth in a decrease of about 20% in sheet resistance. From the XRD results, only variation of peak intensities was observed due to grain growth of the Cu film for the 850°C annealed samples. Also, there was no evidence of Cu diffusion through TiN for the 850°C annealed samples on the Auger and RBS results. It seems that enhanced barrier property of the Cu/TiN/TiSi2 stack is due to the thick TiN layer and the suppression of Ti-oxide formation by the low-temperature nitridation in the first step." @default.
- W2057090429 created "2016-06-24" @default.
- W2057090429 creator A5010715062 @default.
- W2057090429 creator A5016824496 @default.
- W2057090429 creator A5030363363 @default.
- W2057090429 date "1999-06-01" @default.
- W2057090429 modified "2023-10-17" @default.
- W2057090429 title "Barrier properties of TiN/TiSi2 bilayers formed by two-step rapid thermal conversion process for Cu diffusion barrier" @default.
- W2057090429 cites W1979104345 @default.
- W2057090429 cites W1996030118 @default.
- W2057090429 cites W2016340566 @default.
- W2057090429 cites W2035858488 @default.
- W2057090429 cites W2050468714 @default.
- W2057090429 cites W2057634207 @default.
- W2057090429 cites W2071279340 @default.
- W2057090429 cites W2074642450 @default.
- W2057090429 cites W2079560255 @default.
- W2057090429 cites W2079716480 @default.
- W2057090429 cites W2083846292 @default.
- W2057090429 cites W2091545311 @default.
- W2057090429 cites W2094401623 @default.
- W2057090429 cites W2097220862 @default.
- W2057090429 cites W4243645718 @default.
- W2057090429 doi "https://doi.org/10.1016/s0040-6090(99)00040-1" @default.
- W2057090429 hasPublicationYear "1999" @default.
- W2057090429 type Work @default.
- W2057090429 sameAs 2057090429 @default.
- W2057090429 citedByCount "12" @default.
- W2057090429 countsByYear W20570904292019 @default.
- W2057090429 crossrefType "journal-article" @default.
- W2057090429 hasAuthorship W2057090429A5010715062 @default.
- W2057090429 hasAuthorship W2057090429A5016824496 @default.
- W2057090429 hasAuthorship W2057090429A5030363363 @default.
- W2057090429 hasConcept C113196181 @default.
- W2057090429 hasConcept C127413603 @default.
- W2057090429 hasConcept C159985019 @default.
- W2057090429 hasConcept C185592680 @default.
- W2057090429 hasConcept C191897082 @default.
- W2057090429 hasConcept C192191005 @default.
- W2057090429 hasConcept C192562407 @default.
- W2057090429 hasConcept C2777855556 @default.
- W2057090429 hasConcept C2778836790 @default.
- W2057090429 hasConcept C2779227376 @default.
- W2057090429 hasConcept C2779833192 @default.
- W2057090429 hasConcept C42360764 @default.
- W2057090429 hasConcept C43617362 @default.
- W2057090429 hasConcept C525849907 @default.
- W2057090429 hasConcept C59061564 @default.
- W2057090429 hasConcept C98390173 @default.
- W2057090429 hasConceptScore W2057090429C113196181 @default.
- W2057090429 hasConceptScore W2057090429C127413603 @default.
- W2057090429 hasConceptScore W2057090429C159985019 @default.
- W2057090429 hasConceptScore W2057090429C185592680 @default.
- W2057090429 hasConceptScore W2057090429C191897082 @default.
- W2057090429 hasConceptScore W2057090429C192191005 @default.
- W2057090429 hasConceptScore W2057090429C192562407 @default.
- W2057090429 hasConceptScore W2057090429C2777855556 @default.
- W2057090429 hasConceptScore W2057090429C2778836790 @default.
- W2057090429 hasConceptScore W2057090429C2779227376 @default.
- W2057090429 hasConceptScore W2057090429C2779833192 @default.
- W2057090429 hasConceptScore W2057090429C42360764 @default.
- W2057090429 hasConceptScore W2057090429C43617362 @default.
- W2057090429 hasConceptScore W2057090429C525849907 @default.
- W2057090429 hasConceptScore W2057090429C59061564 @default.
- W2057090429 hasConceptScore W2057090429C98390173 @default.
- W2057090429 hasIssue "1-2" @default.
- W2057090429 hasLocation W20570904291 @default.
- W2057090429 hasOpenAccess W2057090429 @default.
- W2057090429 hasPrimaryLocation W20570904291 @default.
- W2057090429 hasRelatedWork W1992456528 @default.
- W2057090429 hasRelatedWork W2012707444 @default.
- W2057090429 hasRelatedWork W2013055614 @default.
- W2057090429 hasRelatedWork W2050754626 @default.
- W2057090429 hasRelatedWork W2076677140 @default.
- W2057090429 hasRelatedWork W2154824307 @default.
- W2057090429 hasRelatedWork W2332731938 @default.
- W2057090429 hasRelatedWork W2465054275 @default.
- W2057090429 hasRelatedWork W4377089197 @default.
- W2057090429 hasRelatedWork W938996102 @default.
- W2057090429 hasVolume "347" @default.
- W2057090429 isParatext "false" @default.
- W2057090429 isRetracted "false" @default.
- W2057090429 magId "2057090429" @default.
- W2057090429 workType "article" @default.