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• W2057353486 startingPage "945" @default.
• W2057353486 abstract "In this study, an inverse algorithm based on the conjugate gradient method and the discrepancy principle is applied to estimate the unknown time-dependent heat transfer rate at the electronic-packaging/heat-sink-assembly interface from the knowledge of temperature measurements taken within the packaging. The temperature data obtained from the direct problem are used to simulate the temperature measurements, and the effect of the errors in these measurements upon the precision of the estimated results is also considered. Results show that an excellent estimation on the time-dependent heat transfer rate can be obtained for the test case considered here." @default.
• W2057353486 created "2016-06-24" @default.
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• W2057353486 date "2008-11-03" @default.
• W2057353486 modified "2023-09-27" @default.
• W2057353486 title "Estimation of the Transient Heat Transfer Rate at the Boundary of an Electronic Chip Packaging" @default.
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• W2057353486 doi "https://doi.org/10.1080/10407780802473574" @default.
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